130C Thermal Conductivity Tester
1. Standard: ISO 22007-2 2008.
2. Direct measurement, testing time is about 5-160s, and can be set up, to quickly and accurately measure the coefficient of thermal conductivity, saving a lot of time.
3. Do not suffer the effects of thermal contact resistance.
4. No need special sample preparation, sample shapes without special requirements, bulk solids, only need the relatively smooth surface and satisfies the length and width of at least twice the diameter of probe can be.
5. Non-destructive testing on samples, samples can be reused.
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SKZ1061C Thermal Conductivity Testing Equipment Price
It can be used for a number of warmth conduction residences of one-of-a-kind kinds of substances testing. Transient Plane Source technique is to learn about the thermal conductivity method, the ultra-modern one, which makes size technological know-how to a entire new level. In the find out about of cloth succesful of speedy and correct size of thermal conductivity for the employer first-class control, fabric manufacturing and laboratory research grant a outstanding convenience. The instrument is convenient to operate, easy to understand, will now not motive injury to the sample.
Test object:
Metal, ceramics, alloys, minerals, polymers, composite materials, paper, fabric, foam (smooth surface insulation material, plate), mineral wool, cement walls, glass-reinforced composite plate CRC, cement polystyrene board, sandwich concrete, glass and steel panels composite plates, paper honeycomb panels, gel, liquid, powder, granular and pasty solid.
Works:
Transient Plane Source science (TPS) is a new technique for measuring the thermal conductivity, through Professor Silas Gustafsson Sweden Chalmer University of Technology developed on the groundwork of the warm wire method. Principle which measures thermal residences is primarily based on the transient temperature heating step countless medium disc-shaped warmth generated response. Thermal resistance fabric fashioned utilising a flat probe, each as a warmth supply and a temperature sensor. Relationship between thermal resistivity-temperature alloys and resistance linear relationship, that is via grasp the trade in resistance can be aware of warmness loss, reflecting the thermal conductivity of the sample. I.e., the probe of this approach is the use of a non-stop double helix shape of the conductive foil after etching alloy formation, the outer layer of the double insulating shielding layer thickness is thin, so that the probe has a sure mechanical electricity and hold the pattern between The electrical insulation. During testing, the probe is positioned in the center of the pattern tested. When the contemporary thru the probe, a positive extend in temperature, the warmness generated concurrently to each aspects of the pattern probe diffusion, thermal diffusion price relies upon on the warmth switch traits of the material. By recording the temperature response time of the probe, the mathematical mannequin can be got at once from the thermal conductivity.
Features:
1. Standard: ISO 22007-2 2008.
2. Direct measurement, testing time is about 5-160s, and can be set up, to quickly and accurately measure the coefficient of thermal conductivity, saving a lot of time.
3. Do not suffer the effects of thermal contact resistance.
4. No need special sample preparation, sample shapes without special requirements, bulk solids, only need the relatively smooth surface and satisfies the length and width of at least twice the diameter of probe can be.
5. Non-destructive testing on samples, samples can be reused.
6. The probe using the double-helix structure design, combined with the exclusive model, data collected on the probe using the core algorithm analysis.
7. Sample stage designed, easy operation, suitable for different thickness of the sample
8. The probe data acquisition using the imported data acquisition on the chip, which is high resolution, can make the tests more accurate and reliable results.
9. Host control system using the ARM microprocessor, speed is faster than traditional microprocessors, improves the processing capacity, more accurate results,
10. It can be used for measuring bulk solids,pasty solid, granular solid, paste, gel, liquid, powders, coatings, thin film, thermal insulation materials.
11. Intelligent freiendly human-computer interface, color LCD display, touch screen controls
12. Powerful data processing capabilities. Highly automated computer processing system for data communication and reporting.
Technical parameters:
Measure method | Transient Plane Heat Source, Unsteady Status |
Measurement physical properties | Direct access the thermal conductivity and thermal diffusivity |
Test object | Solid, liquid, powder, paste, colloid, granule |
Sample size request | No special requested |
Test Range | 0.005--300W/(m*K) |
sample temperature range | Room temperature--130℃ |
Probe diameter | 15mm/7.5mm |
Accuracy | ±3% |
Repeatability | ≤3% |
Measuring time | 5--160 seconds |
Power supply | AC 220V |
Total power | ﹤500w |
SKZ1061C Transient Plane Heat SourceThermal Conductivity Tester
It can be used for measuring bulk solids,pasty solid,granular solid,pastegel,liquid,powders,coatings,thin film,thermal insulation materials.
SKZ1061C Transient Plane Heat SourceThermal Conductivity Tester
The probe is designed with a double helix structure
Easy to operate
Touch screen control
The samples can be reusedStrong data processing ability
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